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Used TEL Batch Equipment List |
|
Maker |
Wafer
Size |
Model |
Type |
Appearance of Equipment |
Config |
Process |
S/N |
Vintage |
Count |
TEL |
12¡± |
EXPEDIUS+ |
Batch |
|
CHCL-CWS-SD2-SD2-HQDR-SC1(MS)
-HQDR-SC1(MS)-HQDR-SPM |
Pre Clean
Post Clean
Co Remove Clean |
W073377 |
2007 |
1 |
EXPEDIUS |
Batch |
|
CHCL-CWS-SD2(HF)-SD2(HF)-OF-
LAL(HF17%)-HQDR-SC1-HQDR-SPM |
Pre Clean
Post Clean
Oxide Wet Etch |
W063298 |
2006 |
1 |
UW300Z |
Batch |
|
CHCL-CWS-SD2(HF)-OF-LAL15
-HQDR-SC1-HQDR-SPM |
Pre Clean
Post Clean
Oxide Wet Etch |
W043124 |
2005 |
1 |
|
|
|
Used TEL Single Equipment List |
|
Maker |
Wafer
Size |
Model |
Type |
Appearance of Equipment |
Config |
Process |
S/N |
Vintage |
Count |
TEL |
12¡± |
CELLESTA+ |
Single |
|
DSP + SC1 + IPA |
DSP Strip
Post (DSP) Clean |
EJ27022 |
2007 |
1 |
CELLESTA-I |
Single |
DSP + SC1 + IPA |
DSP Strip
Post (DSP) Clean |
EJ27019 |
2007 |
1 |
CELLESTA-I |
Single |
|
APM / HF / IPA
Pre CNL. L/P X4. CSB, PRB-F, PRB-B |
Pre Clean
Post Clean |
EE00012A |
2012 |
1 |
CELLESTA-I |
Single |
|
APM / HF / IPACLN. L/P X4. Chemical:
H2O2, NH4OH, IPA, HF. CSB, PRB-F, PRB-B |
Pre Clean
Post Clean |
EE00032 |
2012 |
1 |
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